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Ryan Ho
Director of Business Development
Shenzhen Ylink Computing Co., Ltd
Speaking at SFF 2026
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2:20–2:50pmThu 19 NovSide ProgrammesBeyond Borders Pavilion (Hall 6)Open
Others
Next-Generation Payment Infrastructure — From Real-Time Interconnection to Tokenised Settlement - Powered by Shenzhen Ylink Computing Co., Ltd
About this session
Moving from real-time connectivity to tokenized settlement is not merely about “issuing tokens”; the biggest challenge is dismantling the old set of rules built around end-of-day settlement. When traditional clearing windows, reconciliation cycles, liquidity scheduling, and regulatory reporting cut-off times are completely disrupted, how should bank payment systems be re-architected?
This session will explore this in practice along the bank payment chain and focus directly on three core challenges: how a unified gateway can connect SWIFT, RTGS, fast payment systems, and mBridge; how tokenized deposits can support delivery-versus-payment (DvP) while retaining their deposit attributes; and how, once the end-of-day anchor is gone, the timing and data boundaries of regulatory reporting should be redefined.
